Metal-Bond Tools
EISEN Metal-bond Tools
Metal Bond Tools are grinding tools sintered by blending metal powders, typically copper (Cu) or tin (Sn), with diamond (or CBN) particles. Compared to other diamond abrasives, they exhibit strong retention and superior wear resistance.
Additionally, the self-sharpening effect, where worn abrasive particles are shed to expose new ones, ensures a sustained and stable sharpness over time. Eisen's metal bond tools are customized to meet customer processing conditions and workpiece materials, allowing control over abrasive particles, bond, and concentration to propose the optimal specifications.
Processing with Metal-Bond Tools
Through-hole machining of alumina (Al₂O₃)
Used tool: HC Φ6 #100 Concentration 100%.
Machine: machining centre
Cutting oil: water-soluble cutting oil (external lubrication)
Processing method: drill cycle
Peripheral speed: 75 m/min
Feed: 3 mm/min
Eisen offers optimum specifications by controlling the abrasive grain, bond and concentration to suit the customer's processing conditions and workpiece material type.
It has been introduced in the machining of parts for semiconductor manufacturing equipment, as well as in the automotive and optical equipment industries.
Through-hole machining of quartz (SiO₂)
Used tool: HP Φ20 #140, 80% concentration
Machine: machining centre
Cutting oil: water-soluble cutting oil (external lubrication)
Machining method: helical
Peripheral speed: 100 m/min
Depth of cut: 0.2 mm/Lap
Feed: 500 mm/min
Eisen offers optimum specifications by controlling the abrasive grain, bond and concentration to suit the customer's processing conditions and workpiece material type.
It has been introduced in the machining of parts for semiconductor manufacturing equipment, as well as in the automotive and optical equipment industries.
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